High temperature resistant lead-free solder wire

Whether it is reflow soldering, wave soldering, or manual soldering, the high heat capacity of the lead-free solder wire process is the biggest technical challenge faced by the components in the PCBA installation process. Due to the many packaging forms of the components, the structure is becoming more and more complex. The temperature expansion coefficients of the solder wires used do not match, especially the capacitors containing liquid medium, the extremely brittle chip assembly components and the high-density integrated circuits that use plastic packaging, etc., which are easily damaged during the soldering process. Or cracking and other failures, especially in the connection between the pin terminal and the component body, the probability of failure is particularly high.